Thermal resistance 11 of multi-layer backfill method

Thermal resistance offered by the material in layer 1 along the flow path q1.

Symbol
$R_{q11}$
Unit
K.m/W
Formulae
$\frac{s_{1}}{k_{1} s_{T}}$Paper R. de Lieto Vollaro et al. (2011)
$\frac{\ln{\left(\frac{2 \left(C_{1} \left(c_{T} - s_{3}\right) + s_{3}\right)}{D_{o}} \right)}}{k_{3} \operatorname{atan}{\left(\frac{s_{T}}{s_{3}} \right)}}$Paper R. de Lieto Vollaro et al. (2014)
$D_{o}$